Method of manufacturing semiconductor device

ABSTRACT

A trench gate type power transistor of high performance is provided. A trench gate as a gate electrode is formed in a super junction structure comprising a drain layer and an epitaxial layer. In this case, the gate electrode is formed in such a manner that an upper surface of the epitaxial layer becomes higher than that of a channel layer formed over the drain layer. Then, an insulating film is formed over each of the channel layer and the epitaxial layer and thereafter a part of the insulating film is removed to form side wall spacers over side walls of the epitaxial layer. Subsequently, with the side wall spacers as masks, a part of the channel layer and that of the drain layer are removed to form a trench for a trench gate.

CROSS-REFERENCE TO RELATED APPLICATIONS

The disclosure of Japanese Patent Application No. 2006-354339 filed onDec. 28, 2006 including the specification, drawings and abstract isincorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device manufacturingtechnique. Particularly, the present invention is concerned with atechnique applicable effectively to the manufacture of a semiconductordevice having a trench gate type power transistor.

It is breakdown voltage and ON resistance that are importantcharacteristics required of a power MOSFET (Metal Oxide SemiconductorField Effect Transistor). When comparison is made on the basis of thesame breakdown voltage, it can be said that the lower the ON resistance,the higher the performance. A loss generated during operation can bedecreased by diminishing ON resistance.

As to ON resistance of a low breakdown voltage power MOSFET, a channelresistance developed in a semiconductor layer (silicon layer) isdominant and therefore scaling-down of a cell according to the MOSFETscaling rule is effective for decreasing ON resistance.

On the other hand, as to ON resistance of a high breakdown voltage powerMOSFET, the resistance of a drift layer (drain layer) necessary for theattainment of a high breakdown voltage is dominant. Since the SuperJunction structure (hereinafter referred to as the “SJ structure”) is astructure capable of making the drift layer low in resistance whileensuring a high breakdown voltage and therefore attracts attention ofmany concerns as a structure effective for decreasing the ON resistanceof a high breakdown power MOSFET.

For attaining a low ON resistance there has been proposed a trench gatetype wherein a trench is formed and a gate electrode is buried thereinto reduce the unit cell area.

In U.S. Pat. No. 5,216,275 (Patent Literature 1) there is described atechnique on a trench gate power MOSFET using the SJ structure.

SUMMARY OF THE INVENTION

FIG. 1 is a sectional view of a principal portion of a semiconductordevice provided with a trench gate type power transistor using the SJstructure which the present inventors have studied. This powertransistor, indicated at Q0, is constituted by a MOSFET and is of thesame structure as the MOSFET described in U.S. Pat. No. 5,216,275(Patent Literature 1).

As shown in FIG. 1, the power transistor Q0 as a single cell is formedon a main surface of a semiconductor substrate Sub which is, forexample, an n⁺ type single crystal silicon substrate. A drain electrodeDE is formed on a back surface of the semiconductor substrate Sub. Onthe other hand, on the main surface of the semiconductor substrate Sub,columnar n⁻ type drain layers DL and columnar p⁻ type epitaxial layersEL adjacent thereto are formed in an alternate manner to constitute theSJ structure.

A p type channel layer CL is formed on upper surfaces of the drain andepitaxial layers DL, EL so as to span those layers. Trenches UT areformed so as to extend from an upper surface side of the channel layerand reach the drain layers DL. A gate insulating film GI is formed onside faces and a bottom of each trench UT. Further, a gate electrode GEis formed on the gate insulating film GI so as to fill up the trench UT.

On the upper surface side of the channel layer CL there are formedcontact regions CA and an n⁺ type source region SA is formed betweeneach contact region CA and the gate insulating film GI. A sourceelectrode SE is formed on and electrically connected to the sourceregion SA. The source electrode SE is formed so as to cover the contactregion CA from above and also cover the gate electrode GE from above viaan insulating film IF3.

In the power transistor Q0, when a positive voltage is applied to thegate electrode GE, a channel is formed in the channel layer CL in adirection along the gate insulating film GI and an electric current isflowed through the source electrode SE, source region SA, channel of thechannel layer CL, drain layer DL, semiconductor substrate Sub and drainelectrode DE. Moreover, in the power transistor Q0, there is formed abreakdown voltage between the source electrode SE and the drainelectrode DE by extending a depletion layer from the pn junction of eachn⁻ type drain layer DL and an associated p⁻ type epitaxial layer EL toboth drain layer DL and epitaxial layer EL.

The power transistor Q0 using such an SJ structure can make ONresistance lower than in a power transistor not using the SJ structure,in case of the same breakdown voltage. This is for the following reason.

In the power transistor not using the SJ structure, for example in FIG.1, the p⁻ type epitaxial layer is substituted by the n⁻ type drain layerDL, that is, the portion under the gate electrode GE is constituted byan n⁻ type semiconductor layer (drift layer). Breakdown voltage (BVdss)in this structure is determined by an avalanche breakdown of the pnjunction between the p type channel layer and the n⁻ type semiconductorlayer (drift layer). In this case, an electric field intensitydistribution in the vertical direction (depth direction) within thedepletion layer formed in the drift layer is in a state such that it isthe strongest in the vicinity of the pn junction and becomes weakertoward the substrate. A required breakdown voltage can be achieved byadjusting the concentration of the n⁻ type semiconductor layer and thedistance (thickness) in the vertical direction.

On the other hand, in the power transistor Q0 using the SJ structure,depletion layers are extended from the pn junctions on both sides of thedrain layer DL as the drift layer and an electric field intensitydistribution in the vertical direction ideally assumes a uniform state.In a most ideal case, even if the distance (thickness) in the verticaldirection of the n⁻ type semiconductor layer is made short (thin) tohalf of the power transistor not using the SJ structure, it is possibleto obtain the same breakdown voltage as in the power transistor notusing the SJ structure. Even if the impurity concentration of the n⁻type drain layer DL is made high within a range which permits completedepletion of the drift layer, it is possible to achieve the samebreakdown voltage.

Thus, in the power transistor using the SJ structure, as compared withthe power transistor not using the SJ structure, ON resistance can bemade low even at the same breakdown voltage.

However, in the event of a lateral displacement of a photomask, causingmalalignment, at the time of forming the trench UT which reaches thedrain layer DL in the trench gate type power transistor Q0 using the SJstructure, the trench UT may reach the epitaxial layer EL. In this case,when the power transistor Q0 after completion is brought into aconductive state, the epitaxial layer EL also acts as a channel, withconsequent increase of ON resistance. On the other hand, if the width ofthe drain layer DL is made large to prevent the aforesaid malalignment,the cell pitch will become large and so will the chip area.

It is an object of the present invention to provide a trench gate typepower transistor of high performance.

The above and other objects and novel features of the present inventionwill become apparent from the following description and the accompanyingdrawings.

The following is an outline of a typical mode of the present inventionas disclosed herein.

In the semiconductor device manufacturing method of the presentinvention, a trench for gate is formed by self-align.

The following is a brief description of an effect obtained by thetypical mode of the present invention as disclosed herein.

According to one mode of the present invention it is possible to providea trench gate type power transistor of high performance which permitsformation of a trench for gate without malalignment.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a principal portion of a semiconductordevice which the present inventors have studied;

FIG. 2 is a plan view of a chip in a semiconductor device according to afirst embodiment of the present invention;

FIG. 3 is an enlarged plan view of a principal portion of FIG. 2;

FIG. 4 is a sectional view taken on line A-A′ in FIG. 3;

FIG. 5 is a sectional view of a principal portion in a step of asemiconductor device manufacturing process according to the firstembodiment;

FIG. 6 is a sectional view of a principal portion in another step of thesemiconductor device manufacturing process which follows FIG. 5;

FIG. 7 is a sectional view of a principal portion in a further step ofthe semiconductor device manufacturing process which follows FIG. 6;

FIG. 8 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 7;

FIG. 9 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 8;

FIG. 10 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 9;

FIG. 11 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 10;

FIG. 12 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 11;

FIG. 13 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 12;

FIG. 14 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 13;

FIG. 15 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 14;

FIG. 16 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 15;

FIG. 17 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 16;

FIG. 18 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 17;

FIG. 19 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 18;

FIG. 20 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 19;

FIG. 21 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 20;

FIG. 22 is a diagram for explaining breakdown voltage characteristicsobtained with various changes in doner concentration of a drain layer,acceptor concentration of an epitaxial layer, width of the drain layerand that of the epitaxial layer;

FIG. 23 is a diagram for explaining electric field intensitycharacteristics in the depth direction of the drain layer;

FIG. 24 is a sectional view of a principal portion in a step of asemiconductor device manufacturing process according to a secondembodiment of the present invention;

FIG. 25 is a sectional view of a principal portion in another step ofthe semiconductor device manufacturing process which follows FIG. 24;

FIG. 26 is a sectional view of a principal portion in a further step ofthe semiconductor device manufacturing process which follows FIG. 25;

FIG. 27 is a sectional of a principal portion in a still further step ofthe semiconductor device manufacturing process which follows FIG. 26;

FIG. 28 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 27;

FIG. 29 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 28;

FIG. 30 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 29;

FIG. 31 is a sectional view of a principal portion in a step of asemiconductor device manufacturing process according to a thirdembodiment of the present invention;

FIG. 32 is a sectional view of a principal portion in another step ofthe semiconductor device manufacturing process which follows FIG. 31;

FIG. 33 is a sectional view of a principal portion in a further step ofthe semiconductor device manufacturing process which follows FIG. 32;

FIG. 34 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 33; and

FIG. 35 is a sectional view of a principal portion in a still furtherstep of the semiconductor device manufacturing process which followsFIG. 34.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Embodiments of the present invention will be described in detailhereinunder with reference to the drawings. In all of the drawings forillustration of the embodiments, the same members are identified by thesame reference numerals in principle, and repeated explanations thereofwill be omitted.

First Embodiment

FIG. 2 is a plan view showing a chip condition of a semiconductor deviceprovided with a trench gate type power transistor using the SJ structureaccording to a first embodiment of the present invention. FIG. 3 is asectional view of a principal portion of the semiconductor device shownin FIG. 2. FIG. 4 is a sectional view taken on line A-A′ of thesemiconductor device shown in FIG. 3. The power transistor Q1 accordingto this first embodiment is constituted by a single cell of MOSFET.

As shown in FIG. 2, a semiconductor chip Cp is provided on its mainsurface (element-forming surface) side with a cell region C1A and aperipheral region OA around the cell region. The cell region C1A is aregion in which plural power transistors Q1 are formed. In the cellregion C1A are formed a gate (gate electrode) G and a source (sourceelectrode) S which are electrically connected to gates and sources ofthose power transistors. The pattern of the gate G and that of thesource S are not limited to those shown in FIG. 2. The peripheral regionO1 is a region for terminating a depletion layer extending from eachpower transistor Q1 and is constituted for example by a guard ring. Onthe other hand, on a back surface (not shown) of the semiconductor chipCp there is formed a drain (drain electrode, back electrode) D connectedelectrically to drains of the power transistors Q1 formed in the cellregion C1A.

The semiconductor chip Cp is packaged one or plurally in such a mannerthat the gate, drain and source can be electrically connected to theexterior and is used as a switching device for example in the field ofautomobiles or the field of electric products.

In each power transistor Q1 formed in the semiconductor chip Cp, asshown in FIGS. 3 and 4, a gate electrode GE extends in a directionparallel to the main surface of the semiconductor chip in FIG. 2 and isformed within a trench UT which is formed in a direction perpendicularto the main surface of the semiconductor chip. On a main surface of asemiconductor substrate Sub, as shown in FIG. 4, columnar n⁻ type drainlayers DL and columnar p⁻ type epitaxial layers EL adjacent thereto areformed in an alternate manner to constitute the SJ structure. That is,the power transistor Q1 in this first embodiment is a trench gate typeMOSFET using the SJ structure.

The configuration of the power transistor Q1 will be described belowtogether with a semiconductor device manufacturing method according tothis embodiment. FIGS. 5 to 21 are sectional views of principal portionsof the semiconductor device in various manufacturing steps.

First, as shown in FIG. 5, a semiconductor device Sub constituted forexample by an n⁺ type single crystal silicon substrate is provided andthereafter a drain layer DL constituted by an n⁻ type semiconductorlayer (a single crystal silicon layer) is formed on the semiconductorsubstrate Sub by epitaxial growth. At the time of forming the drainlayer DL there is made adjustment so as to give a predetermined donorconcentration. In FIG. 4, the donor concentration is indicated at Nd.

Subsequently, as shown in FIG. 6, a p type impurity (e.g., boron (B)) isintroduced from an upper surface side of the n⁻ type semiconductor layerSL (drain layer DL) by ion implantation to form a channel layer CL as ap type semiconductor layer on the drain layer DL. Thereafter, aninsulating film IF1 constituted by an oxide film such as, for example, asilicon oxide film, is formed on the channel layer CL by CVD (ChemicalVapor Deposition) for example.

The columnar drain layer DL and columnar epitaxial layer EL shown inFIG. 4 are formed after the formation of the channel layer CL although adescription on this point will be given later. For example, if thechannel layer CL is formed after formation of the drain layer DL and theepitaxial layer EL, the impurity concentration profile of the drainlayer DL and that of the epitaxial layer EL will be impaired by ahigh-temperature long-time heat treatment. In view of this point,according to this first embodiment, the channel layer CL is formedbefore the step of forming the drain layer DL and the epitaxial layerEL, whereby the impurity concentration profile of the drain layer DL andthat of the epitaxial layer can be prevented from being impaired.

Next, as shown in FIG. 7, the insulating layer IF1 is patterned byphotolithography and etching and thereafter, as shown in FIG. 8, withthe insulating film IF1 as a mask, the channel layer CL and the drainlayer DL are partially removed to form plural trenches Th reaching thesemiconductor substrate Sub. When forming the trenches Th, there is madeadjustment so as to give a predetermined size (width). In other words,there is made adjustment so that the width of the drain layer DL whichremains unremoved becomes a predetermined width. In FIGS. 3 and 4, thewidth of the epitaxial layer EL formed in each trench Th and that of thedrain layer DL are indicated at Wp and Wn, respectively.

Then, as shown in FIG. 9, an epitaxial layer EL constituted by a p⁻ typesemiconductor layer is formed within the plural trenches Th and also onthe insulating layer IF1 by epitaxial growth. At the time of forming theepitaxial layer EL there is made adjustment so as to give apredetermined acceptor concentration. In FIG. 4, the acceptorconcentration is indicated at Na. In this epitaxial growth,polycrystalline silicon may be formed on the insulating film IF1 presentwithin the epitaxial layer EL. However, it suffices for the epitaxiallayer (single crystal silicon layer) to be formed within each trench.

Subsequently, as shown in FIG. 10, part of the epitaxial layer EL isremoved by, for example, CMP (Chemical Mechanical Polishing) or etchback to expose an upper surface of the insulating film IF1, then, asshown in FIG. 11, the insulating film 11 is removed so that an uppersurface of the epitaxial layer EL becomes higher than that of thechannel layer CL. The shape of the trench UT in which the gate electrodeGE is formed as in FIG. 4 depends on the height of the projecting upperportion of the epitaxial layer EL.

Next, as shown in FIG. 12, an insulating film IF2 which is a siliconoxide film is formed on both channel layer C1 and epitaxial layer EL byCVD for example and thereafter a part of the insulating film IF2 isremoved by anisotropic etching to form side wall spacers SWS on upperside wall portions of the projecting epitaxial layer EL. The side wallspacers SWS are formed on the channel layer CL. As a result of thisanisotropic etching a part of the upper surface of the channel layer CLis exposed. The width of the trench UT with the gate electrode GE formedtherein as in FIG. 4 is adjusted by changing the thickness of theinsulating film IF2.

Then, as shown in FIG. 14, a part of the channel layer CL and that ofthe drain layer DL are removed by etching with the side wall spacers SWSas masks to form the trench UT for the gate electrode GE shown in FIG.4. As a result of this etching, not only a part of the channel layer CLand that of the drain layer DL, but also a part (upper portion) of theepitaxial layer EL which is also a single crystal silicon layer isremoved.

Thus, the trench UT is formed by self-align. In the power transistor Q0which the present inventors have studied with reference to FIG. 1, inthe event malalignment should occur as a result of lateral displacementof a photomask at the time of forming the trench UT which reaches thedrain layer DL, the trench UT may reach the epitaxial layer EL.Consequently, when the power transistor Q0 is rendered conductive, theepitaxial layer EL also acts as a channel, with consequent increase ofON resistance. In this first embodiment, however, since the trench UT isformed by etching with the side wall spacers SWS as masks, i.e., byself-align, malalignment does not occur and, when the power transistorQ1 is rendered conductive, it is possible to prevent an increase of ONresistance which is caused by the action as a channel of the epitaxiallayer EL.

The margin from the trench UT for gate up to the epitaxial layer EL canbe easily set at 0.5 μm or less (about 1.0 μm or less on both sides ofthe trench because the margin means that a one-side margin of the trenchis 0.5 μm). Forming the trench width to about 0.5 μm is also relativelyeasy with the technique available at present. The width Wn (see FIG. 4)of the drain layer DL corresponds to the distance which is the sum ofthe both-side margin and the trench width and therefore it is possibleto satisfy the condition of Wn=1.5 μm by using such a self-align.Reducing (narrowing) the width Wn of the drain layer DL is advantageousin that complete depletion can be achieved even if the impurityconcentration of the drain layer DL is made high and that therefore ONresistance can be decreased without lowering of breakdown voltage. Therealso is a merit such that the cell pitch can be narrowed and thereforeit is possible to decrease ON resistance.

Subsequently, as shown in FIG. 15, the side wall spacers SWS areremoved. Then, as shown in FIG. 16, a gate insulating film GI which is asilicon oxide film is formed within the trench UT by CVD for example,followed by formation of a polycrystalline silicon film serving as agate electrode GE by CVD for example on the gate insulating film FI.Next, as shown in FIG. 17, a gate electrode GE is formed on the gateinsulating film GI by etching in such a manner that the polycrystallinesilicon film is allowed to remain only within the trench UT. Whenforming the gate electrode GE, a draw-out portion (not shown) of thegate electrode GE is formed using a mask which is a photoresist mask.

Then, as shown in FIG. 18, an n type impurity (e.g., arsenic (As)) isintroduced from the upper surface side of the channel layer CL by ionimplantation to form a source region SA as an n⁺ type semiconductorlayer on top of both channel layer CL and epitaxial layer EL. By thision implantation the polycrystalline silicon film which constitutes thegate electrode GE comes to have electric conductivity. Modification maybe made such that the polycrystalline silicon film which constitutes thegate electrode GE comes to have electric conductivity when it is formed.

Next, as shown in FIG. 19, an insulating film IF3 which is a siliconoxide film is formed on the gate electrode GE by CVD for example and isthereafter subjected to patterning by photolithography and etching asshown in FIG. 20. The insulating film IF3 serves as an interlayerinsulating film for insulation between the gate electrode GE and thesource electrode SE both shown in FIG. 4.

Subsequently, as shown in FIG. 21, a part of the source region SA isremoved in a piercing manner by etching with use of the insulating filmIF3 as a mask, allowing the upper surface of the epitaxial layer EL andthat of a part of the channel layer CL to be exposed. Thereafter, a ptype impurity is introduced by ion implantation from the thus-exposedupper surface of the epitaxial layer and upper surface of a part of thechannel layer CL to form a contact region CA which is a p⁺ typesemiconductor layer. The remaining source region SA functions as asource of the power transistor Q1 shown in FIG. 4. The contact regionacts as a body contact.

Thus, in this first embodiment, the source region SA which functions asthe source is formed after forming the gate electrode GE as the trenchelectrode. For example, when the source region SA (see FIG. 4) whichfunctions as the source is already present on the channel layer CL inthe epitaxial growth process of forming the epitaxial layer EL describedabove in connection with FIG. 9, it is presumed that the following mayoccur by auto doping. That is, it may become impossible to obtain adesired impurity concentration due to introduction of an unexpectedimpurity (e.g., arsenic (As)) in the source region SA into the epitaxiallayer EL and it may become easier for a crystal defect to occur in theepitaxial layer EL at a position near the interface with the sourceregion SA.

Then, as shown in FIG. 4, barrier metal BM is formed by sputtering so asto cover upper surfaces of the contact region CA and the insulating filmIF3 and thereafter a source electrode SE constituted by an aluminum (Al)film is formed on the barrier metal BM by sputtering. Further, aprotective film PF constituted by a polyimide film is formed by spincoating, then a back surface of the semiconductor substrate Sub ispolished and thereafter a drain electrode (back electrode) DE is formedby sputtering. In this way the power transistor Q1 according to thisfirst embodiment is completed.

Next, characteristics of the power transistor Q1 thus having gonethrough the above manufacturing process will be described below togetherwith the operation thereof.

First, with reference to FIG. 4, a description will be given of theoperation for obtaining the breakdown voltage of the power transistorQ1. 0V is applied to both gate electrode GE and source electrode SE andvoltage is applied to the drain electrode DE. At this time, a depletionlayer extends from the pn junction between the n⁻ type drain layer DLconstituted by the SJ structure and the p⁻ type epitaxial layer EL. Whena predetermined voltage is applied to the drain, both drain layer DL andepitaxial layer EL are depleted completely. At this instant, theelectric field intensity in the vertical direction within the depletionlayer is uniform ideally. When the electric field intensity reaches acritical level, there occurs an avalanche breakdown and the voltagedetected at this time corresponds to a breakdown voltage (BVdss). Thus,in the power transistor Q1 using the SJ structure with alternate drainand epitaxial layers DL, EL, a high breakdown voltage can be obtained byextending a depletion layer from the pn junction on each side of thedrain layer DL.

It is assumed that the donor concentration of the drain layer DL is Nd,the acceptor concentration of the epitaxial layer EL is Na, the width ofthe drain layer DL is Wn and that of the epitaxial layer EL is Wp. Inorder to deplete the drain layer DL and the epitaxial layer ELcompletely it is desirable that n=1 in the expression Na×Wp=n×Nd×Wn withn being a coefficient. However, in the case where a trench gate (gateelectrode GE) is present, the breakdown voltage varies with a change ofthe coefficient n, as shown in FIG. 22. Thus, the presence of the trenchgate may obstruct the attainment of an ideal, uniform electric fielddistribution.

Since the breakdown voltage is a voltage obtained by integrating theelectric field intensity distribution upon arrival at the critical levelby distance, it can be said that the more uniform the electric fieldintensity, the higher the breakdown voltage of the device structureconcerned. FIG. 23 illustrates an electric field intensity in the depthdirection of the drain layer DL. Parameters in FIG. 23 are n=1, 1.2, 1.6and a trench gate type power transistor (w/o SJ-column in the figure)not using the SJ structure.

From FIG. 23 it is seen that when the SJ structure is not used and withn=1, the electric field is strengthened in the drain layer DL under thetrench gate electrode GE and thereabouts, not affording a uniformelectric field intensity distribution. Likewise, with n=1.6, theelectric field intensity in the vicinity of the semiconductor substrateSub which is high in concentration becomes high and a uniform electricfield intensity distribution is not obtained. On the other hand, in caseof n=1.2, the electric field intensity distribution can be said uniform.Thus, it can be said that there exists an optimum value of n in order tomake the electric field intensity distribution uniform and attain a highbreakdown voltage. Therefore, by setting n at a value of 1.1 to 1.35,the breakdown voltage can be made high about 5% in comparison with thatat n=1, as shown in FIG. 22. Further, when it is taken into account thatON resistance is to be decreased, it is better to ensure a wide currentpath upon turning ON and hence it is preferable to meet the relationshipWp=Wn.

In this first embodiment, for example in case of forming a powertransistor Q1 with a breakdown voltage of about 200V, the condition ofn=1.2 can be satisfied by setting Nd at 1.0E16 cm⁻³ in the manufacturingstep described above in connection with FIG. 5, Na at 1.2E16 cm⁻³ in themanufacturing step described above in connection with FIG. 9 and Wp andWn at 1.0 μm in the manufacturing step described above in connectionwith FIG. 8.

Next, a conducting operation of the power transistor Q1 will bedescribed with reference to FIG. 4. A positive voltage is applied fromthe drain electrode DE to the semiconductor substrate Sub which is an n⁺type single crystal silicon substrate, while 0V is applied (connected toground) from the source electrode SE to the source region SA formed byan n⁺ type semiconductor layer and also to the contact region CA formedby a p⁺ type semiconductor layer. If in this state a positive voltage isapplied to the gate electrode GE, electrons present within the channellayer CA formed by a p type semiconductor layer gather on the gateinsulating film GI side and an n type channel is formed along the gateinsulating film GI. As a result, electrons fed from the n⁺ type sourceregion SA (source electrode SE) pass through the n type channel and thedrain layer DL formed by an n⁻ type semiconductor layer in this orderand reach the n⁺ type semiconductor substrate Sub (drain electrode DE),so that the power transistor QI turns conductive.

As noted previously, in the process of manufacturing the powertransistor Q1, the trench UT which reaches the drain layer DL is formedby self-align using the side walls spacers SWS without using a mask.Consequently, malalignment does not occur and the trench UT reaching theepitaxial layer EL and the gate electrode EG are not formed. Therefore,while the power transistor Q1 is ON, the p⁻ type epitaxial layer EL doesnot act as a channel. Thus, the electrons fed from the n⁺ type sourceregion SA pass through the n type channel and the drain layer DL formedby an n⁻ type semiconductor layer in this order, so that it is possibleto prevent an increase in ON resistance of the power transistor Q1 whichis caused by the epitaxial layer EL acting as a channel. That is, it ispossible to attain high performance of the trench gate type powertransistor Q1 using the SJ structure. Moreover, since such widening ofthe drain layer DL as in the use of a photomask is not needed, it is notnecessary to enlarge the cell pitch and the chip area.

Second Embodiment

In the above first embodiment a description has been given about thecase where the epitaxial layer EL is formed after forming the channellayer CL. In this second embodiment a description will be given aboutthe case where the channel layer CL is formed after forming the p⁻ typeepitaxial layer.

With reference to FIGS. 24 to 30, a description will be given belowabout a method of manufacturing a semiconductor device provided with atrench gate type power transistor using the SJ structure according tothis second embodiment. Manufacturing steps prior to the manufacturingstep illustrated in FIG. 24 correspond to the manufacturing steps ofFIGS. 5 to 15, provided the channel layer CL is not formed in thesemiconductor layer SL (drain layer DL) in the manufacturing stepdescribed above in connection with FIG. 6. Therefore, explanations ofthose manufacturing steps will be omitted.

As shown in FIG. 24, a gate insulating film GI which is a silicon oxidefilm is formed within each trench UT by CVD for example and thereafter apolycrystalline silicon film serving as a gate electrode GE is formed onthe gate insulating film GI by CVD for example. Then, as shown in FIG.25, a gate electrode GE is formed on the gate insulating film GI byetching in such a manner that the polycrystalline silicon film isallowed to remain only within each trench UT. Thereafter, a p typeimpurity (e.g., boron) is introduced from the upper surface side of bothdrain layer DL and epitaxial layer EL by high energy ion implantationand a channel layer CL is formed on each of drain layer DL and epitaxiallayer EL by RTA (Rapid Thermal Anneal). When forming the gate electrodeGE, a draw-out portion (not shown) of the gate electrode GE is formedusing a mask which is a photoresist mask.

Subsequently, as shown in FIG. 26, an n type impurity (e.g., arsenic(As)) is introduced by ion implantation to form a source region SAconstituted by an n⁺ type semiconductor layer. Next, as shown in FIG.27, an insulating film IF3 which is a silicon oxide film is formed onthe gate electrode GE by CVD for example. Thereafter, as shown in FIG.28, the insulating film IF3 is subjected to patterning byphotolithography and etching.

Next, as shown in FIG. 29, a part of the source region SA is removed ina piercing manner by etching through the insulating film IF3 as a mask,allowing the upper surface of the epitaxial layer EL and that of a partof the channel layer CL to be exposed. Thereafter, a p type impurity isintroduced by ion implantation from the thus-exposed upper surface ofthe epitaxial layer EL and that of a part of the channel layer CL toform a contact region CA constituted by a p⁺ type semiconductor layer.

Then, as shown in FIG. 30, barrier metal BM is formed by sputtering soas to cover the upper surface of the contact region CA and that of theinsulating film IF3 and thereafter a source electrode SE constituted byan aluminum film is formed on the barrier metal BM by sputtering.Further, a protective film PF which is a polyimide film is formed byspin coating, then the back surface of the semiconductor substrate Subis polished and thereafter a drain electrode (back electrode) DE isformed by sputtering. In this way a power transistor according to thissecond embodiment is completed.

Thus, the high-temperature long-time heat treatment can be reduced byusing both high-energy ion implantation and RTA, whereby the channellayer CL can be formed after forming the p⁻ type epitaxial layer EL.

The step of forming the channel layer CL is not limited to the stepcorresponding to FIG. 25, but for example the step corresponding to FIG.11 will do.

Third Embodiment

In the manufacturing steps described above in the first embodiment inconnection with FIGS. 10 and 11 a part of the epitaxial layer EL isremoved by CMP or etch back until the upper surface of the insulatingfilm IF1 becomes exposed and thereafter the insulating film IF1 isremoved so that the upper surface of the epitaxial layer EL becomeshigher than that of the channel layer CL. The height of the projectingupper portion of the epitaxial layer is a factor which dominates theshape of the trench UT in which the gate electrode GE is formed. In thisthird embodiment, therefore, a description will be given below about atechnique which can adjust the height of the projecting upper portionmore accurately.

With reference to FIGS. 31 to 35, the following description is nowprovided about a method of manufacturing a semiconductor device providedwith a trench gate type power transistor using the SJ structureaccording to this third embodiment. A manufacturing step before themanufacturing step illustrated in FIG. 31 is the same as themanufacturing step of FIG. 5 described above in the first embodiment andtherefore an explanation thereof will be omitted.

As shown in FIG. 31, a p type impurity (e.g., boron) is introduced fromthe upper surface side of the n⁻ type semiconductor layer SL by ionimplantation to form on the drain layer DL a channel layer CL which is ap type semiconductor layer. Thereafter, an oxide film OF such as, forexample, a silicon oxide film and a nitride film NF such as, forexample, a silicon nitride film are formed in this order on the channellayer CL by CVD for example. The oxide film OF and the nitride film NFconstitute an insulating film IF1.

Subsequently, as shown in FIG. 32, the insulating film IF1 is subjectedto patterning by photolithography and etching, then, as shown in FIG.33, a part of the channel layer CL and that of the drain layer DL areremoved using the insulating film IF as a mask to form plural trenchesTh reaching the semiconductor substrate Sub.

Next, as shown in FIG. 34, by epitaxial growth using a single crystalsilicon substrate, an epitaxial layer EL which is a p⁻ typesemiconductor layer is formed within each trench Th and on theinsulating film IF1. Then, as shown in FIG. 35, a part of the epitaxiallayer EL is removed by CMP using the nitride film NF as a stopper,allowing an upper surface of the insulating film IF1 to be exposed.Thereafter, the insulating film IF1 comprising both oxide film OF andnitride film NF is removed by etching, so that the thickness thereofbecomes equal to the height of the projecting upper portion of theepitaxial layer EL.

Thus, since the thickness of the insulating film IF1 can be made equalto the height of the projecting upper portion of the epitaxial layer ELby CMP using the nitride film NF as a stopper, it is possible to effecta more accurate adjustment. Consequently, the shape of a trench UT for agate electrode GE to be formed in a later step can be made stable.

Subsequent steps are the same as in the manufacturing process describedabove in the first embodiment and therefore an explanation thereof willbe omitted.

Although the present invention has been described above concretely byway of embodiments thereof, it goes without saying that the presentinvention is not limited to the above embodiments, but that variouschanges may be made within the scope not departing from the gist of theinvention.

Although in the above embodiments the present invention is applied topower transistors of n type channel, the present invention is applicablealso to power transistors of p type channel wherein the n type ofconstituent members is changed to p type and the p type thereof changedto n type.

The present invention is applicable widely to the semiconductor devicemanufacturing industry. Particularly, the present invention is effectivefor a semiconductor device provided with a trench gate type powertransistor using the SJ structure.

1. A method of manufacturing a semiconductor device having a trench gatetype MOSFET, the method comprising the steps of: (a) providing asemiconductor substrate; (b) forming a drain layer over a main surfaceof the semiconductor substrate; (c) forming a channel layer over thedrain layer; (d) forming a first insulating film over the channel layer;(e) removing a part of the channel layer and that of the drain layerwhile using the first insulating film as a mask to form a plurality offirst trenches; (f) after the step (e), forming an epitaxial layer ineach of the first trenches and also over the first insulating film; (g)removing a part of the epitaxial layer to expose an upper surface of thefirst insulating film; (h) after the step (g), removing the firstinsulating film so that an upper surface of the epitaxial layer becomeshigher than that of the channel layer; (i) after the step (h), forming asecond insulating film over each of the channel layer and the epitaxiallayer; (j) after the step (i), removing a part of the second insulatingfilm to form side wall spacers over side walls of the epitaxial layer;(k) after the step (j), removing a part of the channel layer and that ofthe drain layer while using the side wall spacers as masks to form asecond trench for a gate; (l) removing the side wall spacers andthereafter forming a gate insulating film within the second trench; (m)forming a gate electrode over the gate insulating film; and (n) forminga source region over the channel layer.
 2. The method according to claim1, wherein in the step (b) the drain layer is formed by epitaxialgrowth.
 3. The method according to claim 1, wherein in the step (d) anoxide film and a nitride film are formed in this order over the channellayer and are then subjected to patterning to form the first insulatingfilm, and wherein in the step (g) a part of the epitaxial layer isremoved by CMP using the nitride film as a stopper.
 4. The methodaccording to claim 1, wherein when the width of the drain layerremaining in the step (e) is assumed to be Wn, the Wn is adjusted so asto satisfy the condition of Wn=1.5 μm.
 5. The method according to claim1, wherein, given that the donor concentration of the drain layer in thestep (b) is Nd, the width of the drain layer remaining in the step (e)is Wn, the acceptor concentration of the epitaxial layer in the step (f)is Na, and the width of the epitaxial layer formed within each of thefirst trenches in the step (f) is Wp, the Nd, Na, Wn and Wp are adjustedso as to satisfy the condition of Na×Wp=n×Nd×Wn (n=1.1 to 1.35).
 6. Themethod according to claim 1, wherein, given that the donor concentrationof the drain layer in the step (b) is Nd, the width of the drain layerremaining in the step (e) is Wn, the acceptor concentration of theepitaxial layer in the step (f) is Na, and the width of the epitaxiallayer formed within each of the first trench in the step (f) is Wp, theNd, Na, Wn and Wp are adjusted so as to satisfy the conditions of Wp=Wnand Na×Wp=n×Nd×Wn (n=1.1 to 1.35).
 7. The method according to claim 1,wherein, given that the donor concentration of the drain layer in thestep (b) is Nd, the width of the drain layer remaining in the step (e)is Wn, the acceptor concentration of the epitaxial layer in the step (f)is Na, and the width of the epitaxial layer formed within each of thefirst trenches in the (f) is Wp, the Nd, Na, Wn and Wp are adjusted soas to satisfy the conditions of Wp=Wn, Na×Wp=n×Nd×Wn (n=1.1 to 1.35),and Wn=1.5 μm.
 8. A method of manufacturing a semiconductor devicehaving a trench gate type MOSFET, the method comprising the steps of:(a) providing a semiconductor substrate; (b) forming a semiconductorlayer over a main surfaced of the semiconductor substrate; (c) forming afirst insulating film over the semiconductor layer; (d) removing a partof the semiconductor layer while using the first insulating film as amask to form a plurality of first trenches; (e) after the step (d),forming an epitaxial layer within each of the first trenches and alsoover the insulating film; (f) removing a part of the epitaxial layer toexpose an upper surface of the first insulating film; (g) after the step(f), removing the first insulating film so that an upper surface of theepitaxial layer becomes higher than that of the semiconductor layer; (h)after the step (g), forming a second insulating film over each of thesemiconductor layer and the epitaxial layer; (i) after the step (h),removing a part of the second insulating film to form side wall spacersover side walls of the epitaxial layer; (j) after the step (i), removinga part of the semiconductor layer while using the side wall spacers asmasks to form a second trench for a gate; (k) removing the side wallspacers and thereafter forming a gate insulating film within the secondtrench; and (l) forming a gate electrode over the gate insulating film.9. The method according to claim 8, wherein in the step (b) thesemiconductor layer is formed by epitaxial growth.
 10. The methodaccording to claim 8, wherein after the step (1) a channel layer isformed in the semiconductor layer by introducing an impurity into thesemiconductor layer.
 11. The method according to claim 8, wherein in thestep (c) an oxide film and a nitride film are formed in this order overthe semiconductor layer and are then subjected to patterning to form thefirst insulating film, and wherein in the step (f) a part of theepitaxial layer is removed by CMP using the nitride film as a stopper.12. The method according to claim 8, wherein, after the step (l), asource region is formed over the semiconductor layer by introducing animpurity from the upper surface side of the semiconductor layer.